IBM, NEC Electronics, and Toshiba announced an extended a technology development agreement. The agreement covers the participation of the companies in the joint development of 28nm, high-k metal gate low-power chip technology.
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IBM, NEC Electronics, and Toshiba announced an extended a technology development agreement. The agreement covers the participation of the companies in the joint development of 28nm, high-k metal gate low-power chip technology.
Read more »